Manufacturing Challenges in Electronic Packaging

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Manufacturing Challenges in Electronic Packaging

Lee

Rok vydania: 1998

Vydavateľ: Springer

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O knihe:

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

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Podrobnosti o titule (výrobné údaje):

Vydavateľstvo: Springer

Rok vydania: 1998

ISBN: 978-0-412-62030-0

(9780412620300)

Väzba: tvrdá